Idayimani yocingo lokusika iFluid JH-2523

I-JH-2523I-Diamond Wire Cutting Fluid luhlobo olutsha lwemveliso, isetyenziselwa ukusika inkqubo yazo zonke iintlobo zezinto ezinobunzima obuqinileyo (i-silicon ye-monocrystalline, isilicon ye-polycrystalline, i-germanium, i-gallium arsenide, i-quartz, i-indium gallium nitride, i-gems, i-non-metallic. izixhobo, njl.njl.), iimpawu zokuthambisa okugqwesileyo, i-coo ling, ukuxhathisa ukubola, ukuxhathisa umhlwa kunye nomsebenzi wokuthintela i-hydrogen.I-silicon surface TTV emva kokusika incinci ngaphandle kophawu lwecingo kwaye inokwandisa ubomi bocingo lwedayimane.

Iimpawu zeMveliso:
1. Iqulethe izongezo zokucoca iikhemikhali ezizodwa, ukwenzela ukuba i-silicon wafer icoceke kakhulu emva kokusikwa, kulula ukuyicoca emva kokusikwa.
2. Iqulethe izongezo zokucoca iikhemikhali ezizodwa, ukwenzela ukuba i-silicon wafer icoceke kakhulu emva kokusikwa, kulula ukuyicoca emva kokusikwa.
3. Ugwebu oluncinci, kulula ukuyisebenzisa.
4. Ipropathi eyodwa yokunqunyanyiswa, thintela umbhobho webhlokhi yomatshini we-silicon powder.

Indlela yokusetyenziswa:
Le mveliso isebenzisa i-concentration esuka kwi-0.2% ukuya kwi-0.5%, ngokwenkqubo ethile uhlengahlengiso olufanelekileyo.
Ukupakishwa, ukuthutha kunye nokugcinwa: 1kg / umphanda, 25kg / umphanda
Ukugcinwa kwindawo yokuphefumla, epholileyo, eyomileyo

Amanqaku:
1. Ukugcinwa kwinkqubo yokuthintela ioli exutywe namanzi, kungenjalo kunokubangela ukuwohloka kwemveliso.
2. Ukuba umbala wolwelo uba mnyama ngexesha lokugcinwa okanye kwinkqubo yokusebenzisa, ayichaphazeli isiphumo sokusetyenziswa.
3. Ungatyi, yihlambe ngamanzi acocekileyo ngoko nangoko ukuba ithe yangena ngempazamo emehlweni.isibhedlele esinzima ukufumana unyango.