IiParameters zobuGcisa
Ukuqamba | Umxholo | Inombolo yeCAS. |
Amanzi acocekileyo | 85-90% | 7732-18-5 |
I-sodium benzoate | 0.1-0.2% | 532-32-1 |
I-surfactant | 4-5% | ∕ |
Abanye | 4-5% | ∕ |
Iimpawu zeMveliso
I-1, inqanaba eliphezulu lokukhuselwa kokusingqongileyo: Ukuchongwa okukhethiweyo kunokufezekiswa ngaphandle kokusetyenziswa kweziseko eziphilayo ezifana ne-TMAH.
I-2, Iindleko eziphantsi zemveliso: Ukusebenzisa i-NaOH / KOH njengolwelo lwe-etching, ixabiso liphantsi kakhulu kunenkqubo yokupolisha kunye ne-etching.
3, Ukusebenza okuphezulu kwe-etching: xa kuthelekiswa nenkqubo yokupolisha kunye ne-asidi, ukusebenza kwebhetri konyuka ngaphezu kwe-0.15%.
Izicelo zeMveliso
1、 Le mveliso ifanelekile ngokubanzi kwiinkqubo zebhetri zePerc kunye neTopcon;
2, Ilungele iikristale enye ye-210, 186, 166, kunye ne-158 yenkcazo.
Imiyalelo yokusetyenziswa
1, Yongeza isixa esifanelekileyo sealkali kwitanki (1.5-4% ngokusekelwe kumlinganiselo wevolumu ye-KOH/NAOH)
2, Yongeza imali efanelekileyo yale mveliso kwitanki (1.0-2% ngokusekelwe kumlinganiselo wevolumu)
3, Fudumeza ulwelo lwetanki yokukhazimlisa ukuya kuma-60-65°C
4, Beka iwafer yesilicon nge-PSG yangasemva isuswe kwitanki yokupolisha, ixesha lokuphendula yi-180s-250s.
5, Ukunciphisa ubunzima obucetyiswayo kwicala ngalinye: 0.24-0.30g (210 wafer source, eminye imithombo iguqulwa ngomlinganiselo olinganayo) enye kunye ne-polycrystalline PERC iiseli zelanga
Ukulumkela
1, Izongezo kufuneka zigcinwe ngokungqongqo kude nokukhanya.
2, Xa umgca wemveliso ungavelisi, ulwelo kufuneka luzaliswe kwaye lugalelwe yonke imizuzu engama-30.Ukuba akukho mveliso ngaphezu kweeyure ze-2, kuyacetyiswa ukuba ukhuphe kwaye uzalise ulwelo.
3, Ukulungiswa komgca omtsha kufuna uyilo lwe-DOE olusekwe kwinkqubo nganye yomgca wemveliso ukufezekisa ukuhambelana kwenkqubo, ngaloo ndlela ukwandisa ukusebenza kakuhle.Inkqubo ecetyiswayo ingabhekiswa kulungiso lweempazamo.