Izinto eziluncedo Of Diamond Wire Cutting Fluid

Iposwe kwi 2018-07-11I-Diamond wire cutting fluid luhlobo olutsha lwemveliso.Isetyenziselwa ikakhulu ukusika i-corundum yocingo lwezixhobo eziqinileyo ezingezizo ezentsimbi ezifana nesilicon ye-monocrystalline kunye nesilicon yepolycrystalline.Inokutya okugqwesileyo, ukupholisa, ukuchasana nomhlwa, ukuchasa umhlwa kunye nemisebenzi yokucinezela i-hydrogen.Umphezulu we-silicon wafer une-TTV encinci, amanqaku angenazingcingo, kwaye inokwandisa ubomi bocingo lwedayimani.

I-advanteji:

I-1.I-teknoloji ekhethekileyo ye-patent icinezela kwaye isuse i-chip silicon powder ngexesha lokusika, ukuphepha iingozi zokhuseleko ezibangelwa kukuqokelela kwexesha elide lemveliso.

2.Isiphumo esigqwesileyo sokuthambisa sinokuthintela ngokufanelekileyo ukuqhekeka okanye ukukrwela isiqwenga se-silicon ngexesha lenkqubo yokusika, ukunciphisa uburhabaxa bomphezulu kunye nephepha lemfazwe elingaphezulu le-silicon, kunye nokunciphisa ukutenxa ngokupheleleyo kwe-silicon wafer esetyenzisiweyo;

3.Iipropati ezigqwesileyo zokuchasa umhlwa kunye ne-anti-rust, zikhusela izixhobo ekudlekeni kwindawo eneasidi;

4.Izongezo ezigqwesileyo zokuqinisekisa ubomi obude bocingo lwedayimani;

5. Ukubuyisela ngcono, i-chip silicon powder kunye ne-liquid yokusika ingaphathwa ngokulula kwaye isetyenziswe kwakhona nge-centrifugation kunye ne-sedimentation, ngaloo ndlela inciphisa ngokufanelekileyo iindleko zokuvelisa.

6.Kulula ukucoca emva kokusikwa